- Manufacturer：
-
- BOYD (2)
- Comair Rotron (1)
- CUI Devices (1)
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Type：
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6 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
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|
BOYD | TOP MOUNT HEATSINK .45" D2PAK |
15,890
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-263 (D2PK) |
9,392
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK TO-263 19.38X25.40MM |
10,683
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-263 COPPER |
120
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK SMT PKG |
8,621
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 19.4X25.4X11.4MM |
7,084
In-stock
|
View details Get Quote |
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