- Manufacturer：
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- AMEC Thermasol (1)
- BOYD (1)
- CUI Devices (3)
- Attachment Method：
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- Fin Height：
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- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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11 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
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|
T-Global Technology | ALUMINIUM HEAT SINK 22X22MM |
1,017
In-stock
|
View details Get Quote | ||
|
|
BOYD | HTSK-AL-PF750 REV A-G |
662
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPING, TO-218/TO-2 |
2,976
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPING, TO-218/TO-2 |
1,930
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPREADER 22X17MM WH |
207
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPREADER 22X17X0.63 |
42
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | ALUMINIUM HEAT SINK 22X22MM |
67
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPREADER 22X17X1MM |
119
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPREADER 22X17MM WH |
13
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPING, TO-220, 19 |
8,780
In-stock
|
View details Get Quote | ||
|
|
AMEC Thermasol | CERAMIC HEAT SINK - FLAT TYPE |
682
In-stock
|
View details Get Quote |
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