- Manufacturer：
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- BOYD (3)
- CUI Devices (1)
- Attachment Method：
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- Material：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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4 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
.png)
|
BOYD | MAX CLIP HEATSINK |
1,113
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPING, TO-220, 19. |
4,992
In-stock
|
View details Get Quote | ||
|
|
BOYD | MAX CLIP HEATSINK |
912
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT SINK |
8,001
In-stock
|
View details Get Quote |
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