- Manufacturer：
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- Advanced Thermal Solutions, Inc. (10369)
- BOYD (2)
- Comair Rotron (1)
- Cooling Source (8)
- CUI Devices (13)
- Malico (3)
- Ohmite (17)
- Sarnikon (8)
- Wakefield Thermal (30)
- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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10,487 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
.png)
|
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 25MM X 17.5MM |
197
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM ANOD |
1,271
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU FORGED |
1,521
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU FORGED |
1,750
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU FORGED |
414
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU FORGED |
1,829
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X25MM R-TAB FP |
278
In-stock
|
View details Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSINK 25MM DEGREASED |
196
In-stock
|
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|
|
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X10MM L-TAB T766 |
398
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X20MM R-TAB T766 |
498
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X15MM L-TAB T766 |
500
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X15MM R-TAB T766 |
500
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X15MM L-TAB T766 |
500
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X25MM L-TAB T766 |
251
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X17.5MM W/OUT TIM |
106
In-stock
|
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|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218/TO- |
2,966
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218/TO- |
1,973
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218/TO- |
2,387
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218/TO- |
2,008
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X30MM L-TAB FP |
168
In-stock
|
View details Get Quote |
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