- Manufacturer:
-
- BOYD (5)
- Cooling Source (4)
- CTS Corporation (1)
- CUI Devices (3)
- Malico (5)
- Ohmite (3)
- Wakefield Thermal (35)
- Attachment Method:
-
- Fin Height:
-
- Material:
-
- Material Finish:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Product Status:
-
- Shape:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
107 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Cooling Source | 27X27X10MM, T412 |
713
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 27 |
9,372
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | CPU HEATSINK, CROSS CUT, AL6063, |
7,661
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 27X27X19.5MM W/OUT TIM |
9,186
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 27X27X19.5MM W/OUT TIM |
8,197
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 27X27X9.5MM W/OUT TIM |
8,232
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 27X27X9.5MM W/OUT TIM |
8,525
In-stock
|
View details Get Quote |









