- Manufacturer：
-
- BOYD (1)
- Comair Rotron (1)
- Wakefield Thermal (33)
- Attachment Method：
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- Fin Height：
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- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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35 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK CPU 28MM SQBLK W/O TAPE |
9,319
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM SQ BLK W/TAPE |
5,349
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM SQ BLK W/TAPE |
5,619
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM SQ BLK W/TAPE |
5,486
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM SQ BLK W/TAPE |
5,632
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM SQBLK W/O TAPE |
8,430
In-stock
|
View details Get Quote | ||
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|
Wakefield Thermal | HEATSINK CPU 27.9MM SQ W/ADH BLK |
8,291
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM SQ BLK W/TAPE |
8,327
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM SQ BLK W/TAPE |
5,799
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM SQ BLK W/TAPE |
5,010
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM SQ BLK W/TAPE |
6,205
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM SQ BLK W/TAPE |
9,241
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM SQ BLK W/TAPE |
8,317
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM SQ BLK W/TAPE |
5,293
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM SQ BLK W/TAPE |
5,214
In-stock
|
View details Get Quote |
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