- Manufacturer:
-
- Comair Rotron (1)
- CUI Devices (1)
- Material:
-
- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Product Status:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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2 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPING, TO-218/TO-2 |
2,400
In-stock
|
View details Get Quote | ||
|
Comair Rotron | HEATSINK STAMP 22.2X5.4X30.3MM |
5,098
In-stock
|
View details Get Quote |









