- Manufacturer：
-
- BOYD (8)
- CTS Corporation (3)
- CUI Devices (3)
- Attachment Method：
-
- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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21 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
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|
BOYD | HEATSINK TO-220 STAGGEREDFIN TIN |
10,906
In-stock
|
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|
|
BOYD | HEATSINK TO-220 VERT MNT W/TABS |
12,247
In-stock
|
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|
|
BOYD | HEATSINK 24-PIN DIP GLUE-ON BLK |
12,358
In-stock
|
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|
|
BOYD | HEATSINK TO-220 TAB TIN |
2,231
In-stock
|
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|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 COPPER W/TAB |
7,338
In-stock
|
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|
Wakefield Thermal | HEATSINK FOR TO220 |
5,940
In-stock
|
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|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 COPPER W/TAB |
1,253
In-stock
|
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|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 W/TAB BLACK |
989
In-stock
|
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|
|
BOYD | HEATSINK TO-220 TAB BLACK |
98
In-stock
|
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|
|
NTE Electronics, Inc. | HEATSINK FOR PLASTIC PWR |
1,300
In-stock
|
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|
|
CTS Corporation | HEATSINK VERT W/TABS BLK TO-220 |
6,311
In-stock
|
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|
|
CTS Corporation | HEATSINK VERT W/TABS BLK TO-220 |
6,633
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BLACK |
8,092
In-stock
|
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|
|
BOYD | BOARD LEVEL HEAT SINK |
8,425
In-stock
|
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|
|
BOYD | BOARD LEVEL HEAT SINK |
5,370
In-stock
|
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|
|
BOYD | BOARD LEVEL HEAT SINK |
6,064
In-stock
|
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|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218, 31 |
5,682
In-stock
|
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|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218, 31 |
6,025
In-stock
|
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|
|
CUI Devices | HEAT SINK, EXTRUSION,TO-218, 31. |
7,566
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220/202 VERT W/TABS |
8,435
In-stock
|
View details Get Quote |
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