- Manufacturer：
-
- BOYD (1)
- CUI Devices (2)
- Ohmite (1)
- Attachment Method：
-
- Fin Height：
-
- Material：
-
- Material Finish：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Product Status：
-
- Shape：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
10 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
.png)
|
ASSMANN WSW Components | HEATSINK TO-220/TOP-3/SOT-32 |
4,243
In-stock
|
View details Get Quote | ||
|
T-Global Technology | ALUMINIUM HEAT SINK 38X38MM |
1,020
In-stock
|
View details Get Quote | ||
|
|
BOYD | THM,ZA1831 ISS 3 TV-40G |
305
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 38 |
1,558
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | ALUMINIUM HEAT SINK 38X38MM |
33
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 38 |
942
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 DUAL BLACK |
8,028
In-stock
|
View details Get Quote | ||
|
|
TE Connectivity AMP Connectors | CHIPSET HEATSINK FOR PHILIPS |
9,658
In-stock
|
View details Get Quote | ||
|
|
TE Connectivity AMP Connectors | HEAT SINK SFP DWDM 10.0MM TALL |
6,437
In-stock
|
View details Get Quote | ||
|
|
Ohmite | CR202 HEATSINK 38.1MM LONG |
9,273
In-stock
|
View details Get Quote |
Copyright © 2009-2024 lianyixinic.com . All Rights Reserved.