- Manufacturer:
-
- BOYD (24)
- Comair Rotron (4)
- CTS Corporation (10)
- CUI Devices (15)
- Ohmite (10)
- Wakefield Thermal (16)
- Attachment Method:
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- Fin Height:
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- Material:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Product Status:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Width:
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87 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Ohmite | TO-220 HEAT SINK |
2,180
In-stock
|
View details Get Quote | ||
|
BOYD | HEATSINK TO-220 2.5W H=1.5" BLK |
5,715
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 38 |
7,611
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 38 |
9,418
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK TO-220 W/PINS BLK 1.5" |
9,179
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEATSINK TO-220 4W ALUMINUM |
5,808
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT SINK |
8,452
In-stock
|
View details Get Quote |









