- Manufacturer：
-
- BOYD (8)
- CTS Corporation (2)
- CUI Devices (1)
- Wakefield Thermal (26)
- Attachment Method：
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- Fin Height：
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- Material：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Shape：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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38 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK FOR 45MM BGA |
8,842
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 45MM BGA |
5,804
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 45MM BGA |
9,791
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 45MM BGA |
6,046
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 45MM BGA |
6,659
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 45MM BGA |
5,860
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEAT SINK |
5,203
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
5,496
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 45MM BGA |
7,010
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
7,511
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 45MM BGA |
5,816
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT SINK |
8,964
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 45MM BGA |
7,267
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 45MM BGA |
6,151
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 45MM BGA |
7,401
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 45MM BGA |
7,929
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 43MM SQ BLK H=.65" |
5,749
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 45MM BGA |
9,715
In-stock
|
View details Get Quote |
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