- Manufacturer:
-
- BOYD (2)
- CTS Corporation (229)
- CUI Devices (122)
- iWave Systems (3)
- Malico (43)
- Ohmite (80)
- Seeed (3)
- Wakefield Thermal (91)
- Attachment Method:
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- Diameter:
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- Fin Height:
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- Length:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Product Status:
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- Thermal Resistance @ Natural:
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- Filter:
643 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 23 X 23 X 10 MM |
5,076
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | CPU HEATSINK, CROSS CUT, AL6063, |
1,943
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 38 |
1,012
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPING, TO-220, 31 |
1,245
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | HEATSINK CPU XCUT |
5,926
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 40 X 40 X 10 MM |
1,010
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPING, TO-220, 49. |
1,112
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, 19 X 31.5 |
979
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 35 X 35 X 25 MM |
446
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | HEATSINK CPU FORGED |
1,608
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | HEATSINK CPU FORGED |
790
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 40 X 40 X 25 MM |
735
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 43.1 X 43.1 X 16 |
994
In-stock
|
View details Get Quote | ||
|
Ohmite | ALUMINUM HEATSINK 75MM BLK ANODI |
1,270
In-stock
|
View details Get Quote | ||
|
Ohmite | BGA HEATSINK W/TAPE |
480
In-stock
|
View details Get Quote | ||
|
Ohmite | BGA HEATSINK W/TAPE |
370
In-stock
|
View details Get Quote | ||
|
Ohmite | BGA HEATSINK W/TAPE |
282
In-stock
|
View details Get Quote | ||
|
Ohmite | ALUMINUM HEATSINK 75MM BLK ANODI |
310
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | HEATSINK CPU XCUT |
5,279
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPING, TO-220, 29. |
2,631
In-stock
|
View details Get Quote |









