- Manufacturer：
-
- BOYD (2)
- CTS Corporation (229)
- CUI Devices (122)
- iWave Systems (3)
- Malico (43)
- Ohmite (80)
- Seeed (3)
- Wakefield Thermal (91)
- Attachment Method：
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- Diameter：
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- Fin Height：
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- Length：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Shape：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Width：
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- Filter：
643 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
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|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 63 |
7,114
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218, 25 |
6,357
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 63 |
7,330
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU STAMPED |
7,695
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU W/ADHESIVE STAMPED |
5,761
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 50 |
5,391
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 63 |
7,137
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218, 38 |
7,799
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION,TO-220, 38. |
7,514
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPING, TO-218/TO-2 |
6,507
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU W/ADHESIVE STAMPED |
7,888
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU W/ADHESIVE STAMPED |
7,331
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 38 |
6,565
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 38 |
8,685
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 50 |
9,864
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 50 |
8,236
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 50 |
9,277
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU W/ADHESIVE STAMPED |
5,963
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPING, TO-220, 19 |
8,780
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU STAMPED |
5,735
In-stock
|
View details Get Quote |
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