- Manufacturer：
-
- BOYD (2)
- CTS Corporation (229)
- CUI Devices (122)
- iWave Systems (3)
- Malico (43)
- Ohmite (80)
- Seeed (3)
- Wakefield Thermal (91)
- Attachment Method：
-
- Diameter：
-
- Fin Height：
-
- Length：
-
- Material Finish：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Product Status：
-
- Shape：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Type：
-
- Width：
-
- Filter：
643 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
.png)
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 25 |
7,011
In-stock
|
View details Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSINK 25MM BLK ANODI |
8,590
In-stock
|
View details Get Quote | ||
|
|
NTE Electronics, Inc. | HEAT SINK-TO-5 TRANS 1.9W |
188
In-stock
|
View details Get Quote |
Copyright © 2009-2024 lianyixinic.com . All Rights Reserved.