Fin Height:
Length:
Power Dissipation @ Temperature Rise:
Product Status:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Width:
Image Part Manufacturer Description Stock Action
WAVE-40-12 Wakefield Thermal
ANCHOR HEATSINK 40X40X12MM
RFQ
125
In-stock
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BGAH425-125E Ohmite
BGA HEATSINK W/TAPE
RFQ
101
In-stock
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HSE10-B20-NP CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
RFQ
2,966
In-stock
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HSE12-B20-NP CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
RFQ
1,973
In-stock
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HSS19-B20-NP CUI Devices
HEAT SINK, STAMPING, TO-218/TO-2
RFQ
2,976
In-stock
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HSS20-B20-NP CUI Devices
HEAT SINK, STAMPING, TO-218/TO-2
RFQ
1,930
In-stock
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HSS14-B20-NP CUI Devices
HEAT SINK, STAMPING, TO-220, 19.
RFQ
4,992
In-stock
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HSS26-B20-P38 CUI Devices
HEAT SINK, STAMPING, TO-218/TO-2
RFQ
2,998
In-stock
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HSE04-251265-1 CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
RFQ
2,387
In-stock
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HSE04-251265-2 CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
RFQ
2,008
In-stock
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HSS27-B20-P43 CUI Devices
HEAT SINK, STAMPING, TO-218/TO-2
RFQ
2,400
In-stock
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HSE-B20380-040H CUI Devices
HEAT SINK, EXTRUSION, TO-220, 38
RFQ
1,558
In-stock
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HSE-B20250-045H CUI Devices
HEAT SINK, EXTRUSION, TO-220, 50
RFQ
1,057
In-stock
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HSE-B20500-040H CUI Devices
HEAT SINK, EXTRUSION, TO-220, 50
RFQ
1,505
In-stock
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HSE-B20254-056H CUI Devices
HEAT SINK, EXTRUSION, TO-220, 25
RFQ
1,427
In-stock
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HSB25-282810 CUI Devices
HEAT SINK, BGA, 28.5 X 28.5 X 10
RFQ
1,406
In-stock
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HSE01-193175 CUI Devices
HEAT SINK, EXTRUSION, 19 X 31.5
RFQ
1,542
In-stock
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HSE02-173213 CUI Devices
HEAT SINK, EXTRUSION, 17 X 31.9
RFQ
2,841
In-stock
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HSE05-171933 CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
RFQ
1,814
In-stock
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HSE-B18254-0396H CUI Devices
HEAT SINK, EXTRUSION,TO-218, 25.
RFQ
1,798
In-stock
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