- Manufacturer:
-
- BOYD (2)
- CTS Corporation (229)
- CUI Devices (122)
- iWave Systems (3)
- Malico (43)
- Ohmite (80)
- Seeed (3)
- Wakefield Thermal (91)
- Attachment Method:
-
- Diameter:
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- Fin Height:
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- Length:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Product Status:
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- Shape:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Type:
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- Width:
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- Filter:
643 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Wakefield Thermal | ANCHOR HEATSINK 40X40X12MM |
125
In-stock
|
View details Get Quote | ||
|
Ohmite | BGA HEATSINK W/TAPE |
101
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218/TO- |
2,966
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218/TO- |
1,973
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPING, TO-218/TO-2 |
2,976
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPING, TO-218/TO-2 |
1,930
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPING, TO-220, 19. |
4,992
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPING, TO-218/TO-2 |
2,998
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218/TO- |
2,387
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218/TO- |
2,008
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPING, TO-218/TO-2 |
2,400
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 38 |
1,558
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 50 |
1,057
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 50 |
1,505
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 25 |
1,427
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 28.5 X 28.5 X 10 |
1,406
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, 19 X 31.5 |
1,542
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, 17 X 31.9 |
2,841
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218/TO- |
1,814
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION,TO-218, 25. |
1,798
In-stock
|
View details Get Quote |









