- Manufacturer：
-
- BOYD (37)
- Comair Rotron (8)
- Cooling Source (7)
- CUI Devices (3)
- DFRobot (2)
- Malico (2)
- Radian (8)
- Seeed (2)
- T-Global Technology (23)
- Wakefield Thermal (21)
- Attachment Method：
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- Fin Height：
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- Length：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Thermal Resistance @ Natural：
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- Type：
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- Filter：
137 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
.png)
|
Radian | 50MM CU PCI FANSINK 5V+BRASS PIN |
17
In-stock
|
View details Get Quote | ||
|
|
Radian | 50MM CU PCI FANSINK 12V+PLSTCPIN |
17
In-stock
|
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|
|
Cooling Source | 2U and above 2U Server / LGA 201 |
8,976
In-stock
|
View details Get Quote | ||
|
|
Cooling Source | 2U and above 2U Server / LGA 201 |
1
In-stock
|
View details Get Quote | ||
|
|
Cooling Source | 1U Server / LGA 1155/1156/1150 |
1
In-stock
|
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|
|
Cooling Source | 1U server / LGA 2011 (56x94mm) |
6,509
In-stock
|
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|
|
Cooling Source | IU server/ Pentium M, PGA 478/BG |
1
In-stock
|
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|
BOYD | BOARD LEVEL HEATSINK .375" D2PAK |
5,407
In-stock
|
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|
|
Wakefield Thermal | HEATSINK TO-220 PWR SEMI |
9,650
In-stock
|
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|
|
BOYD | HEAT SINK |
8,963
In-stock
|
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|
|
Cooling Source | I U Server / LGA 775 |
9,767
In-stock
|
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|
|
Seeed | RASPERRY PI COPPER HEATSINK KIT |
7,131
In-stock
|
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|
|
Comair Rotron | HEATSINK STAMP 26.2X12.7X9.9MM |
9,660
In-stock
|
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|
|
Comair Rotron | HEATSINK STAMP 22.9X8X10.2MM |
9,816
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 25.4X12.7X30MM |
8,249
In-stock
|
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|
|
Comair Rotron | HEATSINK STAMP 25.9X15X9.5MM |
7,429
In-stock
|
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|
|
Comair Rotron | HEATSINK STAMP 19.4X25.4X11.4MM |
7,084
In-stock
|
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|
|
Comair Rotron | HEATSINK STAMP 25.4X12.7X30MM |
8,569
In-stock
|
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|
|
Comair Rotron | HEATSINK STAMP 13.1X13.2X24MM |
9,323
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 9.5X22X28MM |
6,734
In-stock
|
View details Get Quote |
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