HSB07-202009
- Manufacturer:
- CUI Devices
- Part Number:
- HSB07-202009
- Category:
- Heat Sinks
- Description:
- HEAT SINK, BGA, 20 X 20 X 9 MM
- Datasheets:
- RoHS Status:
-
Lead free/Rosh Compliant
- In Stock:
- 1,068
Specifications
- TYPE
- DESCRIPTION
- Manufacturer :
- CUI Devices
- Category :
- Heat Sinks
- Attachment Method :
- Adhesive
- Diameter :
- -
- Fin Height :
- 0.354" (9.00mm)
- Length :
- 0.787" (20.00mm)
- Material :
- Aluminum Alloy
- Material Finish :
- Black Anodized
- Package Cooled :
- BGA
- Power Dissipation @ Temperature Rise :
- 3.1W @ 75°C
- Product Status :
- Active
- Shape :
- Square, Pin Fins
- Thermal Resistance @ Forced Air Flow :
- 8.60°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- 24.08°C/W
- Type :
- Top Mount
- Width :
- 0.787" (20.00mm)
Request A Quote(RFQ)
please submit the following information
- * Part Number
- Manufacturer
- Quantity
- * Name
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Payment Method
-
The fee is charged according to the rule of HSBC. -
The fee is charged according to the rule of PayPal. -
The fee is charged according to the rule of WESTERN UNION.
Shipping information
-
From $40.00 basic shipping fee depend on zone and country. -
From $40.00 basic shipping fee depend on zone and country. -
From $40.00 basic shipping fee depend on zone and country. -
From $40.00 basic shipping fee depend on zone and country. -
From $40.00 basic shipping fee depend on zone and country. -
From $40.00 basic shipping fee depend on zone and country. -
From $40.00 basic shipping fee depend on zone and country.
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