Fin Height:
Length:
Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Width:
Image Part Manufacturer Description Stock Action
574902B03700G BOYD
HEATSINK TO-220 CLIP-ON/TABS
RFQ
3,373
In-stock
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HSE-B20250-040H-01 CUI Devices
HEAT SINK, EXTRUSION, TO-220, 25
RFQ
1,273
In-stock
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HSB10-232306 CUI Devices
HEAT SINK, BGA, 23 X 23 X 6 MM
RFQ
1,236
In-stock
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HSB07-202009 CUI Devices
HEAT SINK, BGA, 20 X 20 X 9 MM
RFQ
1,068
In-stock
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523002B00000G BOYD
HEATSINK TO-220 W/TAB BLACK
RFQ
3,323
In-stock
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6237BG BOYD
BOARD LEVEL HEATSINK .375"TO-220
RFQ
5,669
In-stock
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V2286B ASSMANN WSW Components
CPU HEATSINK, CROSS CUT, AL6063,
RFQ
2,965
In-stock
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HSB08-212106 CUI Devices
HEAT SINK, BGA, 21 X 21 X 6 MM
RFQ
1,761
In-stock
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HSB12-272706 CUI Devices
HEAT SINK, BGA, 27 X 27 X 6 MM
RFQ
1,455
In-stock
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HSS10-B20-P40 CUI Devices
HEAT SINK, STAMPING, TO-220, 29.
RFQ
1,679
In-stock
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HSB03-121218 CUI Devices
HEAT SINK, BGA, 12 X 12 X 18 MM
RFQ
2,082
In-stock
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ATS-PCB1066 Advanced Thermal Solutions, Inc.
HEATSINK TO-220/TO-262 W/TAB
RFQ
1,510
In-stock
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V5220W ASSMANN WSW Components
HEATSINK ANOD ALUM W/PIN TO-220
RFQ
2,801
In-stock
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501200B00000G BOYD
HEATSINK 14-16 DIP BLACK .19"
RFQ
5,310
In-stock
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576802B04100G BOYD
HEATSINK TO220 CLIPON W/TAB.75"
RFQ
3,808
In-stock
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574502B03700G BOYD
HEATSINK TO220 VER MNT W/TAB.75"
RFQ
8,467
In-stock
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507222B05300G BOYD
HEAT SINK
RFQ
6,644
In-stock
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506007B00000G BOYD
HEATSINK TO-3 LOW PROFILE .375"
RFQ
4,465
In-stock
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V7700W ASSMANN WSW Components
HEATSINK ALUM ANOD
RFQ
13,303
In-stock
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HSS24-B20-NP CUI Devices
HEAT SINK, STAMPING, TO-218/TO-2
RFQ
2,907
In-stock
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